Intel Ramps EMIB-T for 2027 Volume Production as Yields Improve in AI Packaging Race
Updated
Updated · insights.trendforce.com · Aug 18
Intel Ramps EMIB-T for 2027 Volume Production as Yields Improve in AI Packaging Race
3 articles · Updated · insights.trendforce.com · Aug 18
Summary
Intel is pushing EMIB-T into high-volume production to support customer ramps in 2027, after what TrendForce described as a significant improvement in yields.
EMIB-T matters because chipmakers are breaking designs into chiplets as scaling costs rise toward 2nm and below, making dense, low-latency die-to-die interconnects a critical bottleneck.
Intel’s 2.5D approach embeds a silicon bridge in the substrate instead of using a full interposer, giving EMIB lower-cost potential than TSMC’s CoWoS if yield stability proves comparable.
TSMC said its 5.5x reticle CoWoS is already in volume production with yields above 98% and as high as 99%, underscoring the competitive pressure in AI-chip packaging.
Intel has said EMIB-T will scale beyond 8x reticle size this year and past 12x by 2028, though performance and reliability at larger scale still need broader validation.