Xiaomi Unveils 3nm XRING O3 With LPDDR6 Support as It Adds 200-TOPS AI and D100
Updated
Updated · TrendForce · Aug 24
Xiaomi Unveils 3nm XRING O3 With LPDDR6 Support as It Adds 200-TOPS AI and D100
3 articles · Updated · TrendForce · Aug 24
Summary
XRING O3 debuted as Xiaomi’s new 3nm flagship mobile chip, with the Xiaomi 18 Fold set to launch it in September and the Pad 9 Pro Max also adopting it.
10,667Mbps LPDDR6 support and 113.8GB/s memory bandwidth make O3 the first reported mobile processor with LPDDR6, lifting bandwidth 48% from the XRING O1.
200 TOPS of tensor performance, 3.13 TFLOPS of vector performance and 82ns claimed latency anchor Xiaomi’s pitch that O3 boosts on-device AI performance by 45% while improving efficiency.
XRING O100 broadened the launch beyond phones: the 6nm 3D-stacked AI accelerator delivers up to 1.22TB/s bandwidth and 330 tokens per second for large-model inference.
D100 extended Xiaomi’s chip push into cars, with the 3nm driving processor slated for commercial deployment next year and designed to run AI models of up to 200 billion parameters locally.