Kepler Unveils HBM Architecture to Ease Chip Shortage With $468 Million Backing
Updated
Updated · WIRED · Sep 9
Kepler Unveils HBM Architecture to Ease Chip Shortage With $468 Million Backing
3 articles · Updated · WIRED · Sep 9
Summary
Kepler Computing emerged from stealth after seven years, saying its new high-bandwidth memory architecture could ease supply bottlenecks if it can scale manufacturing.
The startup says its 3D stacking and ferroelectric-material approach boosts HBM and SRAM density without EUV lithography, using existing fabs instead of waiting for new multibillion-dollar plants.
Kepler has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures and Bill Gates, and won a US Commerce commitment of up to $245 million in July.
Early production has run on about 2,000 wafers with GlobalFoundries in Singapore and Vermont; Kepler plans first HBM samples later this year, a Singapore ramp in 2027 and US production in 2028.
The main hurdle is scale: GlobalFoundries says the material system must avoid contamination risks, underscoring the broader challenge of turning semiconductor breakthroughs into mass production.