Huawei said its new Ascend 960 SuperPoD is the first AI supernode using near-packaged optics, built to train and run models with up to 10 trillion parameters.
Near-packaged optics aims to cut latency and raise bandwidth as AI systems increasingly depend on linking many processors into one logical computer rather than just boosting single-chip performance.
Huawei also accelerated its next Ascend 960 chip rollout: the 960DT is now due in Q1 2027, three quarters earlier than planned, and the 960PR in Q3 2027, one quarter ahead.
The company said the Ascend 960 series should deliver about double the previous generation's computing performance; more than 1,000 Ascend supernodes have already been deployed and the Ascend 950 is in large-scale commercial use.
The launch highlights China's broader push to scale domestic AI infrastructure, with Huawei planning annual Ascend upgrades through the 970 in 2028 and 980 in 2029.