TSMC Taps GlobalFoundries for $2 Billion US Interposer Push

3 articles · Updated · The Register · Oct 12

$2 billion will go toward a TSMC-GlobalFoundries partnership to expand U.S. silicon interposer production, a key advanced-packaging step for high-performance chips.
Silicon interposers help connect and package complex processors, making them critical to domestic output of semiconductors used in AI datacenters.
The deal strengthens U.S.-based packaging capacity rather than chip design itself, targeting a bottleneck in the supply chain for advanced AI hardware.
The move fits a broader push to build more of the AI semiconductor stack inside the United States as demand for datacenter accelerators keeps rising.

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The Register15h ago

TSMC, GlobalFoundries Partner for $2B US Silicon Interposer Production

eastasiabrief.com7h ago

TSMC widens CoWoS supply chain with $2 billion US interposer deal

Quartz15h ago

GlobalFoundries signs $2B deal to make AI chip part for TSMC

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