Xiaomi to Equip 18 Fold With Xring O3 Chip as 4.5mm Galaxy Fold8 Faces Thinner Rival
Updated
Updated · mezha.ua · Aug 24
Xiaomi to Equip 18 Fold With Xring O3 Chip as 4.5mm Galaxy Fold8 Faces Thinner Rival
3 articles · Updated · mezha.ua · Aug 24
Summary
Xiaomi’s next foldable, the 18 Fold, will be among the first company devices to use its in-house Xring O3 processor, positioning the handset at flagship level.
Xring O3 is expected to compete with Qualcomm’s Snapdragon 8 Elite and MediaTek’s Dimensity 9600 Pro, signaling Xiaomi’s push to pair premium hardware with its own silicon.
Lei Jun was recently seen carrying the foldable, and images suggest a slim design that could undercut the Galaxy Fold8’s 4.5mm unfolded thickness; Xiaomi also showed a render during its HyperOS 4 presentation.
Rumors point to a 6,000 mAh battery, wireless charging, a 200 MP rear camera and a 7.6-inch foldable display, though Xiaomi has not officially confirmed specifications or launch timing.